VC (temperature equalization board)

Vapor Chamber (VC) is a vacuum chamber with a metal inner wall attached to a capillary structure. When the heat generated by the device is transferred from the device surface to the V-C evaporation zone, the working fluid in the chamber is heated to produce steam under a certain vacuum degree. The process is accompanied by rapid volume expansion, and the working fluid in the vapor phase flows quickly to the entire chamber under a small pressure difference. When the working fluid in the vapor phase comes into contact with an environment slightly lower than the saturation temperature of the vapor phase change, it will produce a phase change condensation phenomenon of saturated steam. Through the condensation phenomenon, the heat absorbed during evaporation is released, and the condensed coolant will be transported back to the heat source evaporation zone through the capillary structure. This operation will... The process is repeated inside the cavity.
1. Compared to traditional VC and HP heat dissipation modules, the heat dissipation efficiency is increased by more than 15% and 25% respectively;
2. Can effectively manage heat dissipation for high power and high heat flux devices;
3. Overcoming directional limitations, VC has transformed heat transfer from two-dimensional to three-dimensional, comprehensively enhancing the capabilities of electronic components or systems.
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