Liquid cooling utilizes pump force to circulate the coolant in the cooling pipeline and effectively dissipate heat.
Liquid cooling can be divided into: integrated liquid cooling plate, phase change liquid cooling composite heat dissipation system, high-density liquid cooling heat dissipation system, connecting pipe liquid cooling plate, buried pipe liquid cooling plate, etc., which can effectively solve the thermal management needs of products.

1. Suitable for efficient thermal expansion of high heat flux devices, quickly expanding to large areas for heat dissipation;
2. Suitable for temperature control management of high-power devices;
3. The thermal resistance of the product is relatively low;
4. The product process is stable and can achieve high reliability requirements;