Cooling Module

Heat Sink

heat sink HS( Heat Sink) refers to the heat conduction of the waste generated by the device to a larger extended surface through the heat conduction of the material/heat transfer element, and the extended surface dissipates the waste heat of the device through the convection/radiation of the outer surface In the environment or heat sink, so that the temperature of the device is controlled. The design uses high heat transfer elements and materials, such: heat pipes, VC, LHP, LTS, PHP, etc. The materials are mainly stainless steel, copper, aluminum, ceramics, graphite, etc.

 

radiator is an indispensable structural part in the heat dissipation mechanism. It generally has good thermal conductivity and a large heat dissipation area. It can provide a lower thermal conductivity and provide a lower heat dissipation resistance. The reasonable use of the fan can achieve a better use effect.

Cooling Module

Application Field

can be applied to notebook computers, workstations and servers, CPU/GPU heat dissipation, 5G base stations, LED heat dissipation, high-speed rail, robots, monitoring equipment, security equipment, charging piles, new energy, new energy vehicles, projectors, medical equipment, servers, communication cabinets, industrial control, military industry, etc.
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